IBM’S ATOMIC-AGE CHIP PUSH
IBM this week unveiled a “nanostack” design that stacks transistors in 3D to pack far more components into the same footprint. The company says the approach reaches sub‑nanometer scales (around 0.7 nm), approaching atomic dimensions and promising bigger performance gains as 2D scaling slows. IBM plans to combine vertical (3D sequential) transistor architectures with new materials and […]










